Wire sawing silicon carbide powder
Wire-sawing for semiconductor silicon wafer is a process in which the machine drives the steel wire in high-speed operation, so that the slurry mixed with polyethylene glycol and silicon carbide powder is sent to the cutting area by the steel wire. In the high-speed operation of the steel wire, friction occurs continuously with the workpiece pressed on the wire to complete the cutting process.
Lianyungang Woxin Advanced Material Co., Ltd. produces green silicon carbide powder for cutting semiconductor silicon wafers. The product quality is stable and has been recognized by large foreign silicon wafer manufacturers. The company's products, especially the products of GC#2000 and GC#1500, have been put into mass supply and the quality is very stable.
